LOCTITE ECCOBOND UF3808 capillary underfill is designed to cure quickly at low ECCOBOND UF3810 LOCTITE UF3808
temperatures to minimize stress to other components. When
cured, this material provides excellent mechanical properties to
protect solder joints during thermal cycling.
TYPICAL PROPERTIES OF UNCURED MATERIAL UF3838T
Viscosity @ 20 s-1 , Cone and Plate, mPa?s (cP) 360
Specific, 1.16
Pot life @ 25 °C, 25% viscosity increase, days 3
Shelf Life @ -20°C, months 6
Flash Point - See MSDS
LOCTITE ECCOBOND UF3820 UF2801 UF3840
